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cm-p115160-e1129060-aem-publish-65999d946-7sl27
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EVONIK INDUSTRIES Program - Core
evonik.core
0.0.1.SNAPSHOT
2025-09-17T12:41:32.545

Bonding with Thermal Innovation

Hotmelts are needed in automotive, construction, electronics and packaging. By adding silanes Evonik has revolutionized the hotmelt adhesives and sealants industry with DYNASYLAN®. Silanes significantly improve adhesion to critical substrates like metals, glass, ceramics, and plastics. The durable bond withstands temperature fluctuations and moisture. Silanes enhance mechanical properties like tensile strength and elasticity, so that hotmelts absorb and dissipate mechanical stresses. Bonded assemblies gain strength and flexibility, accommodating movement and deformation, thus extending the lifespan of products. Silanes maintain a stable working time, ensuring consistent curing rates and improving efficiency in large-scale applications. With DYNASYLAN®, manufacturers gain superior hotmelts performance in their products.

Dynasylan®